Semiconductor

To provide an efficient and stable one-stop semiconductor equipment supplier

The SEMI BU focuses on testing equipment related to semiconductor industry chain and makes future strategic layout for other advanced semiconductor process equipment. The products include wafer inspection, SiP packaging test, SoC chip test, CIS chip test, BMS chip test, RF chip test , AOI defect inspection and other services.

ATE
Handler
AOI
BMS Testing Equipment
Consumables

Features and Advantages

The SEMI BU is in charge of the core technologies of chip electrical measurement, optical measurement, image measurement, high-precision automatic control technology and reliability contact mating technology. With the advantages of multi-disciplinary comprehensive capabilities domestic and overseas, the SEMI BU provides the customers with high-efficiency and low-cost one-stop testing solutions. At the same time, it also has achieved breakthroughs in core technologies on many advanced testing equipment. The products have been recognized by customers, and have successfully obtained mass production orders in the semiconductor industry globally.

Technology

Independent R&D, efficient, stable and fully functional software testing platform
Products

Turnkey solutions for testing machines, sorting machines, AOI and consumables
Delivery Time

Standardized products, short delivery time
Technical Team

Nearly 100 AE and FSE engineers

ATE
Handler
AOI
Customization

- T7600 series SoC Digital ATE
- PXIe Platform Testing Equipment
- CIS ATE
- RF CHIP TESTER
- T7600 series SoC Digital ATE
  
  6 slots(T7600S)
  Digital channels support up to 768channels
  Power channels support 72channels
  12 slots(T7600M)
  Digital channels support up to 1536channels
  Power channels support 144channels
  18 slots(T7600H)
  Digital channels support up to 2304channels
  Power channels support 216channels
  Digital board DP128
  128 digital channels, 400Mbps, DPS 12channels, RVS 4channels, BPMU 4channels
  FVI32 floating voltage board
  Support up to 32 channels
  Voltage range: ±10V
  Voltage accuracy: ≤±0.5mV
  MAX current: 38.4A（1.2A/channel）
  Support Gang
  DPS64 power board
  Support up to 64 channels
  Voltage Range: -2.5~8V
  Current output 1.5A/channel
  Ganged up to 96A
  MX32 analog board
  HS: 0~250MHz, HR: 0~40KHz,
  THD -115dB
  Various channel configuration methods
  16 HS AWG+16 HS DIG
  16 HR AWG+16 HR DIG
  8 HS AWG + 8 HS DIG + 8 HR AWG+8 HR DIG
- PXIe Platform Testing Equipment
  
  Two chassis
  6-slot PXIe-C0601, 12-slot PXIe-C1201
  A variety of self-developed boards
  digital boards, power boards, analog boards and RF boards, etc
  Compatible with other brand systems
  With self-developed multi-function software development platform
- CIS ATE
  
  Support up to 16 Sites Parallel Testing
  Support MIPI, DVP and LVDS interface
  MIPI supports up to 1.6Gbps/lane
  LVDS supports up to 1.0Gbps/lane
  DC Performance
  192 DC channels and 96 power channels
  Digital Performance
  Digital supports up to 384 channels, 400Mbps
- RF CHIP TESTER
  
  Test frequency up to 6GHz, power up to 35dBm
  Support SPI, MIPI and custom digital communication libraries
  Noise Figure measurement: Support Y-Factor and Cold Noise methods
  32 bidirectional RF ports with 8 input and 8 output for high power
  Domestic chip leading enterprises stable mass production
- 16 Site CIS PnP Handler
- 128 Site PnP Handler
- Turret Handler
- 16 Site CIS PnP Handler
  
  Support up to 16 Sites Parallel Testing
  Support self-contained light source or other types of light source
  MAX UPH：4,500
  MIN size of product can be tested
  2mm×2mm
- 128 Site PnP Handler
  
  Support up to 128 Sites Parallel Testing
  UPH>11,000 (T.T.>30s)
  Jam Rate<1/5000
  MIN size of product can be tested
  2mm×2mm
  Support QR code, character and chip recognition
  Support SECS/GEM with completed analysis Tool
  Handler + PXIe all-in-one platform solution
- Turret Handler
  
  Two models
  20stations、32stations
  Support six-surface inspection
  Support QFN, DFN, SOIC and other packages
  UPH>30,000
  MTBA>1h
- Wafer Macroscopic Defect AOI Solution
- Wafer Macroscopic Defect AOI Solution
  
  Deploying precise mobile platform in positioning with super-high HFR(high frame rate) data acquisition capability, to improve the customer’s productivity
  Possessing sub-micron optical resolution, able to detect the defects in manufacturing
  Supporting BF/DF multi-mode imaging, thus to display the defects more intuitively
  Employing deep learning algorithms for an automatic defect classification, to realize manpower and cost saving
- BMS Automatic Testing Solution
- Six-surface Automatic Testing Equipment
- BMS Automatic Testing Solution
  
  Independently developed battery management chip testing equipment
  Completely replace manual operation
  Data is uploaded to the client MES system in real time
  Designated products of international leading mobile phone enterprises
  Automatic loading and unloading of carriers and life management
  Available for most of the BMS chip testing, BMU and battery pack testing
  High precision detection in ultra wide voltage and current range
  Minimum measuring accuracy: voltage 0.3mV, current 0.4μA
  Follow general instrument testing standards both domestic and overseas
- Six-surface Automatic Testing Equipment
  
  UPH up to 15k, six-surface visual inspection
  Tray in mode effectively avoids secondary damage of high-end chips
  AI algorithms are combined with traditional algorithms to customize the optical system
  OCR/Code reading includes defect types on all sides